Photonics Packaging & Cryogenic Integration R&D Engineer

Quandela is a global leader in quantum computing, designing, building, and delivering cutting-edge quantum solutions for research and industry.
Its offerings include a very energy-efficient quantum computers for data centers, full-stack quantum computing solutions accessible via the cloud, and algorithm access services for academic and industrial customers.
Following a pragmatic, step-by-step roadmap, Quandela has been deploying industrial-grade systems since 2023 while developing future generations of fault-tolerant quantum computers capable of scaling through the integration of thousands of photonic components.
Quandela is committed to making quantum computing accessible to all in order to address the most complex industrial and societal challenges.
Learn more at: Quandela | Leading Photonic Quantum Computing Solutions

Description of the Team/Project

We are looking for a Photonics Packaging & Cryogenic Integration Engineer to contribute to the development and industrialization of our photonic quantum systems.

You will work on the integration of single-photon sources, photonic integrated circuits and optical/electromechanical assemblies, with a strong focus on miniaturization, automation and operation under cryogenic conditions.

This is a highly hands-on role at the intersection of photonics, electronics, mechanics, automation and experimental physics.

You will contribute across the full development cycle: design, prototyping, assembly, testing, optimization and transfer toward industrial-scale production.

Your Key Responsibilities:

Requirements

What we're looking for:

You should ideally bring:

• A PhD in electrical engineering, mechanical engineering, applied physics, condensed matter physics, solid-state physics, optics, photonics or a related field.

• Strong hands-on experience building and testing scientific or high-precision equipment.

• Experience with photonics, optomechanics, semiconductor devices, cryogenics or precision engineering.

• Familiarity with optical alignment, fiber coupling and/or photonic packaging.

• Experience with mechanical design and CAD tools.

• Good understanding of electronics, instrumentation and test equipment.

• Programming skills in Python, C++, Rust or similar languages for automation and hardware control.

• Experience working with multidisciplinary systems combining optics, mechanics, electronics and software.

• Strong experimental problem-solving skills and the ability to iterate quickly from concept to prototype.

• Excellent written and spoken English, with the ability to produce clear technical documentation and collaborate in an international environment.

Nice to Have

Experience in one or more of the following areas would be particularly valuable:

• Cryogenic systems and experiments at very low temperatures.

• Photonic or optoelectronic packaging.

• Chip bonding, indium bump bonding or related micro-assembly techniques.

• Pick-and-place systems or automated precision assembly.

• Nano-positioning and multi-axis motion control systems.

• Robotics or computer vision.

• FPGA or microcontroller development.

• PCB design using KiCad or similar tools.

• Finite-element simulation using tools such as ANSYS or COMSOL.

• Semiconductor or quantum photonics environments.

More than a specific academic background, we are looking for someone who enjoys building complex scientific systems and solving problems directly at the hardware level.

Benefits

• Competitive salary, flexible based on your experience

• Company savings plan

• 100% health coverage (Alan)

• 50% transport reimbursement or sustainable mobility bonus

• Meal vouchers (Swile), Gymlib fitness support

• Childcare assistance & referral bonuses (€1,000–€2,000)

What we offer:

• A meaningful role with real ownership, from day one

• A team eager to collaborate and grow with you

• A hybrid work model (3-4 days/week onsite in Massy, 1 day in Paris or 1 to 2 days remotely)

• Daily exposure to the entire quantum stack — from high-level APIs to low-level firmware, and everything in between.

Process

• Talent Acquisition Interview (30' - 45')

• Hiring Managers Interview (45')

• Use Case (a live use case or one to be prepared at home and presented afterward)

• Meeting with the teams

• 2 to 3 reference check

• Offer

(This process is provided for guidance only and may evolve depending on the roles)

At Quandela, we believe that the strength of our team is the plurality of experiences, perspectives, and journeys. We are committed to building a respectful, inclusive, and welcoming work environment. All applications are welcome.

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