Siemens AG
80538 München - Deutschland
Informatiker/in
Arbeit
Vollzeit
ab 17.01.2026
Beschreibung
Siemens EDA
is a global technology leader in Electronic Design Automation software. Our
software tools enable companies around the world to develop highly innovative
electronic products faster and more cost-effectively. Our customers use our
tools to push the boundaries of technology and physics to deliver better
products in the increasingly complex world of chip, board, and system design.
**Overview:**
Siemens EDA
is expanding its Innovator 3DIC portfolio and advanced packaging capabilities.
W... weiter lesen
is a global technology leader in Electronic Design Automation software. Our
software tools enable companies around the world to develop highly innovative
electronic products faster and more cost-effectively. Our customers use our
tools to push the boundaries of technology and physics to deliver better
products in the increasingly complex world of chip, board, and system design.
**Overview:**
Siemens EDA
is expanding its Innovator 3DIC portfolio and advanced packaging capabilities.
W... weiter lesen
Siemens EDA
is a global technology leader in Electronic Design Automation software. Our
software tools enable companies around the world to develop highly innovative
electronic products faster and more cost-effectively. Our customers use our
tools to push the boundaries of technology and physics to deliver better
products in the increasingly complex world of chip, board, and system design.
**Overview:**
Siemens EDA
is expanding its Innovator 3DIC portfolio and advanced packaging capabilities.
We are seeking a **Senior Product Manager (m/f/d)** to lead product strategy
and execution for EBS packaging products. This role will drive roadmap
alignment, customer engagement, and integration across multi-die, interposer,
and substrate design workflows.
**Key
Responsibilities:**
- Own product vision and roadmap for
EBS packaging solutions, ensuring alignment with Siemens’ Innovator 3DIC
strategy.- Define and prioritize features for
products to support advanced IC packaging, heterogeneous integration, and
3Dblox standards.- Collaborate with R&D, UX, and
engineering teams to deliver intuitive, AI-infused workflows for complex
substrate and interposer design.- Engage with foundry partners,
ecosystem vendors, and strategic customers to validate requirements and
workflows.- Support go-to-market activities,
including messaging, positioning, and enablement for sales and field teams.- Monitor competitive landscape and
emerging technologies in 3DIC packaging and system-level integration.- Represent Siemens in industry
consortia and standards bodies (e.g., 3Dblox, OCP).
**Required
Skills & Qualifications:**
- Proven experience in IC packaging
design flows, EDA tools, and advanced packaging technologies.- Strong understanding of multi-die
integration, interposer/substrate design, and system-level co-design.- Familiarity with Xpedition tool
suite- Ability to translate complex
technical requirements into actionable product strategies.- Excellent communication and
leadership skills for cross-functional collaboration.- BS/MS in Electrical Engineering or
related field; experience in semiconductor packaging or EDA strongly preferred.
**Preferred:**
- Experience with foundry workflows, 3Dblox standards, and heterogeneous integration.
·
**Working
at Siemens Software**
**Why us?**
We look
forward to your application! Please use only our career platform, which you can
access via "Apply now".
Send us an
email to [careers-DACH.sisw@siemens.com](mailto:careers-DACH.sisw@siemens.com), if you would like to clarify
initial questions with our recruiting team. Contact person for this job
advertisement is **Dominik Strumidel –** **[dominik.strumidel@siemens.com](mailto:dominik.strumidel@siemens.com)**
Come and
learn more about Siemens Software: [Mission / Vision and our software portfolio](https://www.sw.siemens.com/) - or visit our [homepage](https://www.plm.automation.siemens.com/global/de/).
We value
equal opportunities and welcome applications from [people with disabilities](https://new.siemens.com/de/de/unternehmen/jobs/arbeiten-bei-siemens/jobs-ohne-barrieren.html). At Siemens, we believe people
who’ve had real experiences dealing with being different will excel as leaders.
Let's foster a culture of creativity and innovation. We will ensure that
individuals with disabilities are provided reasonable accommodation to
participate in the job application or interview process, to perform essential
job functions, and to receive other benefits and privileges of
employment. Please contact us to request accommodation.
**Transform
the everyday**
**#LI-EDA**
**#LI-Hybrid
#LI-DS1**
is a global technology leader in Electronic Design Automation software. Our
software tools enable companies around the world to develop highly innovative
electronic products faster and more cost-effectively. Our customers use our
tools to push the boundaries of technology and physics to deliver better
products in the increasingly complex world of chip, board, and system design.
**Overview:**
Siemens EDA
is expanding its Innovator 3DIC portfolio and advanced packaging capabilities.
We are seeking a **Senior Product Manager (m/f/d)** to lead product strategy
and execution for EBS packaging products. This role will drive roadmap
alignment, customer engagement, and integration across multi-die, interposer,
and substrate design workflows.
**Key
Responsibilities:**
- Own product vision and roadmap for
EBS packaging solutions, ensuring alignment with Siemens’ Innovator 3DIC
strategy.- Define and prioritize features for
products to support advanced IC packaging, heterogeneous integration, and
3Dblox standards.- Collaborate with R&D, UX, and
engineering teams to deliver intuitive, AI-infused workflows for complex
substrate and interposer design.- Engage with foundry partners,
ecosystem vendors, and strategic customers to validate requirements and
workflows.- Support go-to-market activities,
including messaging, positioning, and enablement for sales and field teams.- Monitor competitive landscape and
emerging technologies in 3DIC packaging and system-level integration.- Represent Siemens in industry
consortia and standards bodies (e.g., 3Dblox, OCP).
**Required
Skills & Qualifications:**
- Proven experience in IC packaging
design flows, EDA tools, and advanced packaging technologies.- Strong understanding of multi-die
integration, interposer/substrate design, and system-level co-design.- Familiarity with Xpedition tool
suite- Ability to translate complex
technical requirements into actionable product strategies.- Excellent communication and
leadership skills for cross-functional collaboration.- BS/MS in Electrical Engineering or
related field; experience in semiconductor packaging or EDA strongly preferred.
**Preferred:**
- Experience with foundry workflows, 3Dblox standards, and heterogeneous integration.
·
**Working
at Siemens Software**
**Why us?**
We look
forward to your application! Please use only our career platform, which you can
access via "Apply now".
Send us an
email to [careers-DACH.sisw@siemens.com](mailto:careers-DACH.sisw@siemens.com), if you would like to clarify
initial questions with our recruiting team. Contact person for this job
advertisement is **Dominik Strumidel –** **[dominik.strumidel@siemens.com](mailto:dominik.strumidel@siemens.com)**
Come and
learn more about Siemens Software: [Mission / Vision and our software portfolio](https://www.sw.siemens.com/) - or visit our [homepage](https://www.plm.automation.siemens.com/global/de/).
We value
equal opportunities and welcome applications from [people with disabilities](https://new.siemens.com/de/de/unternehmen/jobs/arbeiten-bei-siemens/jobs-ohne-barrieren.html). At Siemens, we believe people
who’ve had real experiences dealing with being different will excel as leaders.
Let's foster a culture of creativity and innovation. We will ensure that
individuals with disabilities are provided reasonable accommodation to
participate in the job application or interview process, to perform essential
job functions, and to receive other benefits and privileges of
employment. Please contact us to request accommodation.
**Transform
the everyday**
**#LI-EDA**
**#LI-Hybrid
#LI-DS1**
Ref-Nr.: 8770297
Aktualisiert:
16.01.2026
Quelle: Bundesagentur für Arbeit
weitere Infos Rechtliche Hinweise zur Nutzung
Ob die Stelle noch verfügbar ist und weitere Informationen findest du direkt auf der Website der Bundesagentur für Arbeit. Bitte beachte: OPROMA ist nicht der Anbieter dieser Stelle und kann keine Auskünfte geben.
weitere Infos Rechtliche Hinweise zur Nutzung
Ob die Stelle noch verfügbar ist und weitere Informationen findest du direkt auf der Website der Bundesagentur für Arbeit. Bitte beachte: OPROMA ist nicht der Anbieter dieser Stelle und kann keine Auskünfte geben.
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